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Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging

Serguei Stoukatch1, Francois Dupont1, Philippe Laurent1

  • 1Microsys Laboratory, Department of Electrical Engineering and Computer Science (Institut Montefiore), University of Liège, 4000 Liège, Belgium.

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Summary

This study developed a 3D model for metal-oxide (MOX) gas sensors, optimizing packaging and materials using finite element modeling (FEM). Thermal analysis confirmed the need for insulation, leading to a novel composite that improves sensor performance.

Keywords:
MOX sensor packagingfinite element modeling (FEM)microassemblythermal management of electronic packagesthermal modeling

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Area of Science:

  • Materials Science
  • Sensor Technology
  • Computational Modeling

Background:

  • Metal-oxide (MOX) gas sensors require precise temperature control for optimal performance.
  • Accurate thermal management is crucial for sensor reliability and longevity.
  • Existing packaging solutions may not adequately address thermal challenges in MOX sensor operation.

Purpose of the Study:

  • To create a 3D geometrical model of a MOX gas sensor and its packaging for finite element modeling (FEM) analysis.
  • To predict and analyze temperature and heat flux distribution within the sensor assembly.
  • To optimize sensor design, materials, and electrical interconnects based on thermal modeling insights.

Main Methods:

  • Designed a 3D geometrical model of the MOX gas sensor and its custom packaging.
  • Performed finite element modeling (FEM) analysis using GetDP software to simulate thermal behavior.
  • Developed and utilized an in-house xerogel-epoxy composite with low thermal conductivity for insulation.
  • Assembled and characterized functional packaged MOX gas sensors in various configurations.
  • Employed thermal imaging infrared (IR) microscopy for non-contact temperature measurements.

Main Results:

  • The 3D FEM simulation accurately predicted temperature distribution and identified hot spots.
  • Thermal modeling confirmed the necessity of low thermal conductivity insulation for the MOX sensor operating at 250 °C.
  • An in-house xerogel-epoxy composite with a thermal conductivity of 0.108 W m-1 K-1 was developed, offering at least 30% lower conductivity than commercial alternatives.
  • Experimental results from IR thermal characterization showed good agreement with FEM predictions.

Conclusions:

  • 3D FEM is a valuable tool for optimizing MOX gas sensor design and packaging.
  • The developed xerogel-epoxy composite effectively insulates the MOX sensor, enhancing thermal management.
  • The study successfully designed, assembled, and characterized a functional packaged MOX gas sensor with improved thermal properties.