Comparative Study on Micro-Grinding Performance of 2.5D C_f/SiCs, 2.5D SiC_f/SiCs, and SiC Ceramics

To investigate the micro-grinding process and performance of 2.5D C_f/SiC composites and 2.5D SiC_f/SiC composites in depth, single-factor micro-grinding experiments were conducted by using SiC ceramics as a comparison. Differences in the material removal process, surface microstructure, surface roughness, and grinding force of the three materials under the same grinding parameters were comparatively analyzed. The results indicate that crack propagation is severe during the micro-grinding process of SiC ceramics. The ground surface is uneven, accompanied by pit defects and large surface roughness Ra. However, the presence of reinforcing fibers and interfaces in the two types of composites can inhibit crack propagation or change their extension directions. Therefore, their surfaces are smooth and flat after grinding, with small defects and low surface roughness Ra. In addition, the grinding processes of the two composites are both related to fiber orientation. There are differences in crack propagation paths and fiber fracture positions in the weft fiber layer and the radial fiber layer, which result in different forms of grinding defects. During micro-grinding, the real-time force signals of 2.5D C_f/SiC composites and 2.5D SiC_f/SiC composites are relatively stable, while the signals of SiC ceramics have a large number of spikes. The average micro-grinding force of the three materials is: SiC ceramics > 2.5D SiC_f/SiC composites > 2.5D C_f/SiC composites.