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SEU Hardened D Flip-Flop Design with Low Area Overhead
Chenyu Yin1, Yulun Zhou1, Hongxia Liu1
1Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education, School of Microelectronics, Xidian University, Xi'an 710071, China.
Micromachines
|October 28, 2023
Summary
A new D flip-flop (DFF) design enhances radiation protection against single event upsets (SEUs). This hardened DFF offers improved SEU immunity and reduced power consumption compared to traditional designs.
Area of Science:
- Digital Electronics
- Integrated Circuit Design
- Radiation Hardening
Background:
- D flip-flops (DFFs) are fundamental to sequential logic but susceptible to single event upsets (SEUs) caused by high-energy particles due to internal cross-coupled inverters.
- SEUs can corrupt data stored in flip-flops, leading to errors in digital circuits.
Purpose of the Study:
- To propose a novel D flip-flop structure with enhanced capability for single event upset (SEU) fortification.
- To evaluate the performance of the proposed DFF against traditional DFFs and Dual Interlocked Storage Elements (DICEs) in terms of SEU immunity, area, and power consumption.
Main Methods:
- Introduction of an asymmetric scheme where the master-slave latch employs different hardening structures.
- Comparative analysis of the proposed DFF with traditional DFFs and DICE structures under identical operating conditions.
- Evaluation of SEU threshold, transistor count (area cost), and power consumption (average and peak).
Main Results:
- The proposed DFF exhibits an SEU threshold improvement of 10 times compared to traditional D flip-flops.
- The new structure requires six fewer transistors than the DICE structure, resulting in reduced area cost.
- Average and peak power consumption are reduced by 9.8% and 18.8% respectively, compared to DICE circuits.
Conclusions:
- The proposed asymmetric D flip-flop design offers significantly improved SEU tolerance.
- This DFF provides a favorable trade-off between circuit speed and SEU hardening, making it suitable for radiation-prone environments.
- The design demonstrates advantages in area and power efficiency over existing hardened flip-flop solutions like DICE.
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