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Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging
Song Wang1,2, Tianyu Hou2, Rui Huo2
1School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.
Materials (Basel, Switzerland)
|October 28, 2023
Summary
A novel packaging technique significantly enhances hermeticity for microwave transmitter/receiver modules. This advancement overcomes limitations of traditional ball grid array packaging, improving reliability and performance.
Area of Science:
- Materials Science
- Electrical Engineering
- Microwave Engineering
Background:
- Low-temperature co-fired ceramic (LTCC) substrates and ball grid array (BGA) packaging offer high integration and miniaturization for microwave devices.
- Existing BGA packaging exhibits limitations in hermeticity, cost, and reproducibility, hindering optimal performance.
Purpose of the Study:
- To introduce and validate a new packaging technique to overcome the hermeticity limitations of conventional BGA packaging.
- To enhance the reliability and performance of microwave transmitter/receiver modules.
Main Methods:
- Utilizing an electroless plated Nickel/Palladium/Gold (Ni/Pd/Au) surface for enhanced packaging hermeticity.
- Employing Sn63Pb37 and Au80Sn20 solder alloys for exceptional solderability, investigating Palladium diffusion during soldering.
- Conducting reliability tests, including shear strength measurements after thermal shocks.
Main Results:
- Achieved a significant, orders-of-magnitude enhancement in packaging hermeticity, reaching <5 × 10-9 Pa·m3/s.
- Demonstrated exceptional solderability with both Sn63Pb37 and Au80Sn20 solder alloys.
- Observed a negligible impact of solder ball shear strength reduction on overall packaging hermeticity after thermal shocks.
- Engineered internal vertical interconnects and I/O interconnections for excellent transmission (10-40 GHz) and port isolation.
Conclusions:
- The novel Ni/Pd/Au plated packaging technique substantially improves hermeticity and reliability for microwave modules.
- The developed packaging is suitable for high-frequency applications, maintaining excellent electrical performance and isolation.
- This approach offers a viable solution to overcome the hermeticity challenges in BGA packaging for advanced microwave systems.
