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Copper Sintering Pastes with Various Polar Solvents and Acidic Activators
Seungyeon Lee1, Seong-Ju Han1, Yongjune Kim2
1Department of Polymer Engineering, School of Chemical and Materials Engineering, The University of Suwon, Hwaseong, Gyeonggi-do 18323, Republic of Korea.
ACS Omega
|October 30, 2023
Summary
This study optimized copper sintering pastes for semiconductor packaging. Ethanol-based pastes with phthalic acid additives yielded the highest electrical conductivity and mechanical strength, improving device reliability.
Area of Science:
- Materials Science
- Nanotechnology
- Semiconductor Manufacturing
Background:
- Advanced semiconductor devices demand high-density packaging solutions beyond conventional wire bonding and soldering.
- Sintering offers a stable bonding method for microelectronic applications, overcoming limitations of traditional techniques.
- Optimizing copper (Cu) sintering paste composition is crucial for enhancing performance in microelectronic packaging.
Purpose of the Study:
- To investigate the impact of diverse additives and solvents on the properties of Cu sintering materials.
- To determine the optimal composition and bonding conditions for Cu sintering pastes.
- To evaluate the mechanical and electrical characteristics of sintered Cu materials for semiconductor applications.
Main Methods:
- Fabrication of Cu sintering materials using 1 μm Cu particles with various solvents (methanol, ethanol, ethylene glycol) and acidic additives (benzoic acid, phthalic acid, hexanoic acid).
- Optimization of solvent-to-acid ratios for improved viscosity and long-term storage.
- Assessment of mechanical strength and electrical conductivity after the sintering process.
Main Results:
- Ethanol (EtOH) as a solvent consistently resulted in the highest sintering performance across all formulations.
- Aromatic and carboxylic groups in additives significantly enhanced sintering performance and electrical conductivity.
- The optimal composition, EtOH/PA (phthalic acid), demonstrated superior electrical conductivity (approx. 10^4 S/m) and mechanical strength (34.0 MPa), with an O/Cu ratio of 2.23%.
Conclusions:
- The choice of solvent and additive is critical for achieving high-performance Cu sintering pastes.
- Ethanol and phthalic acid provide optimal conditions for enhanced electrical and mechanical properties in sintered Cu interconnects.
- This research offers valuable insights for tailoring sintering processes to maintain electrical integrity in advanced semiconductor packaging.
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