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Tough soldering for stretchable electronics by small-molecule modulated interfacial assemblies.

Liqing Ai¹, Weikang Lin^2,3, Chunyan Cao¹

¹Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China.

Nature Communications

|November 24, 2023

Summary

Researchers developed a novel stretchable solder for flexible electronics. This material enhances conductivity and stretchability, enabling robust, recyclable 3D conformable circuits for soft robots and wearables.

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Area of Science:

Materials Science
Robotics
Electronics Engineering

Background:

Soft robots and wearable devices require flexible conductive materials for reliable function under deformation.
A key challenge is the interface mismatch between soft substrates and rigid microelectronics, leading to circuit failure.

Purpose of the Study:

To develop a stretchable solder that strongly bonds electronic components to soft substrates.
To address the limitations of current materials in interfacing rigid microelectronics with flexible systems.

Main Methods:

Fabrication of a stretchable solder using hierarchical assemblies of liquid metal particles, small-molecule modulators, and a non-covalently crosslinked polymer matrix.
Characterization of the solder's conductivity, stretchability, and toughness.
Demonstration of its application in thermoforming for 3D conformable electronics.

Main Results:

The developed solder exhibits high conductivity (>2×10^5 S m^-1) and extreme stretchability (~1000%, >600% with chip integration).
The material demonstrates high toughness (~20 MJ m^-3) and unique features like ease of integration, component substitution, and circuit recyclability.
Successful application in thermoforming for 3D conformable electronics was shown.

Conclusions:

The novel stretchable solder effectively bridges the gap between rigid microelectronics and soft substrates.
This material offers a scalable solution for fabricating chip-integrated stretchable circuits and 3D electronics.
The developed technology has significant potential for advancing soft robotics, wearable devices, and conformable electronic systems.