Trap Characterization Techniques for GaN-Based HEMTs: A Critical Review
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Updated: Jul 19, 2026

Scanning-probe Single-electron Capacitance Spectroscopy
Published on: July 30, 2013
Xiazhi Zou1,2, Jiayi Yang1,2, Qifeng Qiao3
1School of Microelectronics, Shanghai University, Shanghai 200444, China.
Abstract:
Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) have been considered promising candidates for power devices due to their superior advantages of high current density, high breakdown voltage, high power density, and high-frequency operations. However, the development of GaN HEMTs has been constrained by stability and reliability issues related to traps. In this article, the locations and energy levels of traps in GaN HEMTs are summarized. Moreover, the characterization techniques for bulk traps and interface traps, whose characteristics and scopes are included as well, are reviewed and highlighted. Finally, the challenges in trap characterization techniques for GaN-based HEMTs are discussed to provide insights into the reliability assessment of GaN-based HEMTs.
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