Characterization of Photocurable IP-PDMS for Soft Micro Systems Fabricated by Two-Photon Polymerization 3D Printing

Recent developments in micro-scale additive manufacturing (AM) have opened new possibilities in state-of-the-art areas, including microelectromechanical systems (MEMS) with intrinsically soft and compliant components. While fabrication with soft materials further complicates micro-scale AM, a soft photocurable polydimethylsiloxane (PDMS) resin, IP-PDMS, has recently entered the market of two-photon polymerization (2PP) AM. To facilitate the development of microdevices with soft components through the application of 2PP technique and IP-PDMS material, this research paper presents a comprehensive material characterization of IP-PDMS. The significance of this study lies in the scarcity of existing research on this material and the thorough investigation of its properties, many of which are reported here for the first time. Particularly, for uncured IP-PDMS resin, this work evaluates a surface tension of 26.7 ± 4.2 mN/m, a contact angle with glass of 11.5 ± 0.6°, spin-coating behavior, a transmittance of more than 90% above 440 nm wavelength, and FTIR with all the properties reported for the first time. For cured IP-PDMS, novel characterizations include a small mechanical creep, a velocity-dependent friction coefficient with glass, a typical dielectric permittivity value of 2.63 ± 0.02, a high dielectric/breakdown strength for 3D-printed elastomers of up to 73.3 ± 13.3 V/µm and typical values for a spin coated elastomer of 85.7 ± 12.4 V/µm, while the measured contact angle with water of 103.7 ± 0.5°, Young's modulus of 5.96 ± 0.2 MPa, and viscoelastic DMA mechanical characterization are compared with the previously reported values. Friction, permittivity, contact angle with water, and some of the breakdown strength measurements were performed with spin-coated cured IP-PDMS samples. Based on the performed characterization, IP-PDMS shows itself to be a promising material for micro-scale soft MEMS, including microfluidics, storage devices, and micro-scale smart material technologies.