Maximizing Roughness Factors in Oxide-Derived Copper Coatings through Electrodeposition Parameters for Enhanced...

Area of Science:

• Materials Science
• Electrochemistry
• Environmental Catalysis

Background:

• Developing dispersed copper catalysts is vital for decarbonization and CO2 electroreduction.
• Comparing oxide-derived copper electrocatalyst activity is hindered by inconsistent electrochemically active surface area (ECSA) data.

Purpose of the Study:

• To investigate oxide-derived copper's potential for high ECSA.
• To compare catalyst microstructures from acetic and lactic acid deposition solutions.

Main Methods:

• Electrochemical deposition of copper oxides from acetic and lactic acid solutions.
• Characterization of oxide morphologies and electrochemically reduced film roughness.
• Estimation of roughness factors (ECSA proxy) based on deposition charge.

Main Results:

• Distinct Cu2O oxide morphologies were observed: dense columnar from acetate, fine-grained porous from lactic acid.
• Roughness factors showed linear correlation with deposition charge, with differing slopes for each solution.
• A high roughness factor of 650 was achieved using lactic acid deposition, indicating a high ECSA for oxide-derived copper.

Conclusions:

• Controlling electrodeposited oxide microstructure is key to maximizing surface roughness and ECSA.
• Lactic acid deposition offers a promising route to high-surface-area oxide-derived copper catalysts.
• Standardized ECSA determination is needed for reliable comparison of copper electrocatalysts.