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Published on: June 2, 2017
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High-quality and efficient large-area copper removal utilizing laser-induced active mechanical peeling
Optics Express
|December 13, 2023
Summary
A novel laser scanning strategy effectively removes large copper layers from printed circuit boards (PCBs) using laser-induced active mechanical peeling (LIAMP). This method enhances efficiency and minimizes substrate damage for electronics manufacturing.
Area of Science:
- Materials Science
- Manufacturing Engineering
- Laser Processing
Background:
- Large-area copper layer removal is critical for manufacturing printed circuit boards (PCBs) and frequency selective surfaces (FSS).
- Conventional laser direct ablation (LDA) often results in substrate damage and material residue, limiting its effectiveness.
- Existing methods like laser direct write lithography combined with wet chemical etching (LDWL+WCE) can be inefficient or involve multiple steps.
Purpose of the Study:
- To propose and investigate a new laser scanning strategy for efficient, one-step, large-area copper layer removal.
- To leverage the laser-induced active mechanical peeling (LIAMP) effect for copper removal from FR-4 copper-clad laminates (FR-4 CCL).
- To optimize scanning parameters to minimize substrate damage and material residue.
Main Methods:
- Implementation of a laser scanning strategy based on the laser-induced active mechanical peeling (LIAMP) effect, utilizing resin decomposition.
- Application of the method to FR-4 CCL for one-step copper layer removal without manual intervention.
- Optimization of laser energy deposition through control of scanning parameters such as energy density, pulse duration, and repetition frequency.
Main Results:
- Achieved maximum removal efficiencies of 31.8 mm²/ms (energy density), 30.25 mm²/ms (pulse duration), and 82.8 mm²/ms (repetition frequency).
- Demonstrated effective avoidance of substrate damage and copper residue by optimizing laser parameters.
- Reported efficiency improvements of 8.3 times over LDWL+WCE and 66 times over conventional LDA.
Conclusions:
- The proposed laser scanning strategy based on LIAMP offers a simple, controllable, and highly efficient method for large-area copper layer removal.
- This technique effectively mitigates substrate damage and material residue, outperforming existing methods significantly.
- The LIAMP strategy holds considerable potential for applications in electronics, communications, and aerospace industries.
