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X-ray-based overlay metrology using reciprocal space slicing analysis.

Jiahao Zhang, Xiuguo Chen, Tianjuan Yang

    Optics Letters
    |December 15, 2023
    PubMed
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    This study introduces a novel x-ray-based overlay metrology technique using reciprocal space slicing analysis (RSS). This method offers high-precision overlay measurement, overcoming limitations of current optical and x-ray diffraction methods for semiconductor manufacturing.

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    Area of Science:

    • Materials Science and Engineering
    • Metrology and Measurement Science
    • Nanotechnology and Semiconductor Manufacturing

    Background:

    • Overlay metrology is critical for lithography tool performance and process yield control in semiconductor manufacturing.
    • Current optical diffraction-based overlay metrology faces sensitivity limitations.
    • Existing x-ray methods like critical-dimension small-angle x-ray scattering (CDSAXS) have throughput constraints due to reciprocal space mapping (RSM) and inverse problem solving.

    Purpose of the Study:

    • To propose a novel x-ray-based overlay metrology method with enhanced precision and throughput.
    • To address the limitations of existing metrology techniques in semiconductor fabrication.
    • To explore the potential of x-ray-based techniques for integrated circuit metrology.

    Main Methods:

    • Development of an x-ray-based overlay metrology technique utilizing reciprocal space slicing analysis (RSS).
    • Measurement performed at a single angle of incidence (AOI).
    • Analysis of the method's robustness against errors in overlay target grating fabrication and measurement.

    Main Results:

    • Achieved high-precision overlay measurement using the proposed RSS method.
    • Demonstrated the method's efficacy and robustness against fabrication and measurement errors.
    • Validated the potential of x-ray-based techniques for advanced integrated circuit metrology.

    Conclusions:

    • The proposed x-ray-based overlay metrology using RSS is a viable and effective technique.
    • This method offers a promising alternative to current metrology, enhancing precision and throughput.
    • X-ray-based metrology holds significant potential for future integrated circuit fabrication and inspection.