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Related Experiment Video

Updated: Jul 6, 2025

High Throughput Single-cell and Multiple-cell Micro-encapsulation
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A Dual Encapsulation Strategy for High-Temperature Micro PCM Particles with High Cyclic Durability.

Kaichen Wang1, Keyu Tao1, Feng Ye1

  • 1Key Laboratory of Power Station Energy Transfer Conversion and System of MOE, School of Energy Power and Mechanical Engineering, North China Electric Power University, Beijing, 102206, P. R. China.

Small (Weinheim an Der Bergstrasse, Germany)
|January 3, 2024
PubMed
Summary

This study developed dual-encapsulated phase change materials (PCMs) for high-temperature applications. The novel microcapsules demonstrate excellent thermal stability and durability over 5000 cycles.

Keywords:
TiO2form‐stablehigh cyclic durabilityhigh temperaturemicroencapsulation

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Energy Storage

Background:

  • Phase change materials (PCMs) face challenges like leakage and degradation at high temperatures, hindering their application.
  • Effective encapsulation is crucial for improving the stability and performance of high-temperature PCMs.

Purpose of the Study:

  • To develop a dual encapsulation strategy for high-temperature micro PCM particles.
  • To enhance the thermal stability, cyclic performance, and thermal conductivity of PCMs.

Main Methods:

  • Al-Si core microencapsulation using "solvent evaporation-heating curing".
  • TiO2 skeleton formation via "cold pressed sintering" for form-stable microcapsules.
  • Incorporation of hexagonal boron nitride (hBN) to improve thermal conductivity.

Main Results:

  • TiO2 demonstrated excellent thermal stability and potential as a structural material.
  • hBN incorporation enhanced thermal conductivity by 121.1-131.3%.
  • Form-stable phase change microcapsules (FSPCMs) showed no leakage or rupture after 5000 thermal cycles, with minimal oxidation (3.3% mass gain).
  • FSPCMs retained 91.3% enthalpy after 2000 cycles and over 80% after 5000 cycles.

Conclusions:

  • The dual encapsulation strategy effectively addresses high-temperature challenges for PCMs.
  • The developed FSPCMs exhibit exceptional thermal stability, oxidation resistance, and long-term cyclic durability.
  • These advanced microencapsulated PCMs show great promise for high-temperature energy storage applications.