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Adhesion Characterization and Enhancement between Polyimide-Silica Composite and Nodulated Copper for Applications in

Sagar M Doshi1, Alexander Barry1, Alexander Schneider1,2

  • 1Center for Composite Materials, University of Delaware, Newark, Delaware 19716, United States.

ACS Applied Materials & Interfaces
|January 4, 2024
PubMed
Summary

This study enhances copper/polyimide adhesion for advanced electronics by optimizing processing conditions. Increased temperature and pressure significantly improve mechanical interlocking and peel strength in printed wiring boards.

Keywords:
adhesionbonding mechanismsmechanical interlockingmicroelectronicsnodulespeel testingprocess optimizationsurface roughness

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Area of Science:

  • Materials Science and Engineering
  • Surface Science
  • Polymer Science

Background:

  • Printed wiring boards (PWBs) require thinner, flexible, and durable materials for high-speed electronics and 5G applications.
  • Mismatched coefficients of thermal expansion (CTE) between polyimide (PI) and copper foils cause residual stresses.
  • Silica nanoparticles can reduce PI's CTE, but their effect on adhesion needs investigation.

Purpose of the Study:

  • To investigate the influence of silica nanoparticles on the adhesion of copper/polyimide laminates.
  • To evaluate the role of mechanical interlocking in enhancing copper/polyimide adhesion.
  • To develop and validate an analytical model for optimizing PWB processing parameters.

Main Methods:

  • Fabrication of copper/polyimide/copper laminates with varying silica nanoparticle concentrations in polyimide.
  • 90° peel testing to measure peel strength.
  • Failure surface analysis using scanning electron microscopy (SEM), energy-dispersive X-ray analysis (EDX), and X-ray photoelectron spectroscopy.
  • Development and validation of an analytical model for polyimide penetration and mechanical interlocking.

Main Results:

  • Laminates with no silica nanoparticles exhibited approximately 3.75 times higher peel strength than those with 40% silica.
  • Mechanical interlocking, where polyimide engulfs copper nodules, was identified as a key bonding mechanism.
  • Increased processing temperature and pressure resulted in a 3-fold increase in peel strength due to enhanced polyimide penetration.

Conclusions:

  • Silica nanoparticles decrease the peel strength of copper/polyimide laminates, likely by affecting mechanical interlocking.
  • Optimizing processing parameters (temperature, pressure, time) is crucial for maximizing mechanical interlocking and adhesion.
  • The developed methodology provides a framework for calculating optimal processing conditions to enhance PWB functionality and adhesion.