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Charge Carrier Induced Structural Ordering And Disordering in Organic Mixed Ionic Electronic Conductors
Tyler J Quill1, Garrett LeCroy1, Adam Marks1
1Department of Materials Science and Engineering, Stanford University, Stanford, CA, 94305, USA.
Operational stability of organic mixed ionic-electronic conductors (OMIECs) is key for electronics. High charge densities cause microstructural disruptions, leading to device instability and reduced conductivity in OMIECs.
Area of Science:
- Materials Science
- Organic Electronics
- Solid-State Chemistry
Background:
- Operational stability is crucial for organic mixed ionic-electronic conductors (OMIECs) in applications like biosensing and neuromorphic computing.
- Understanding the factors affecting OMIEC stability is essential for advancing their use in electronic devices.
Purpose of the Study:
- To investigate the operational stability of a p-type OMIEC material across different molecular weights.
- To elucidate the microstructural mechanisms underlying device instability at high charge densities.
Main Methods:
- Electrochemical transistor measurements were used to assess device performance and stability.
- Operando X-ray scattering techniques were employed to observe structural changes during device operation.
- Varying molecular weights of the OMIEC material were tested.
Main Results:
- Devices showed stable operation for over 300 cycles at low charge densities, irrespective of molecular weight.
- High charge densities led to increased device hysteresis and decreased conductivity due to reduced hole mobility.
- Operando X-ray scattering revealed two regimes: ordering at low carrier densities and irreversible disordering at high densities, linked to polaron interactions.
Conclusions:
- Device stability in OMIECs is maintained below a critical charge density threshold.
- Microstructural disordering at high charge densities, driven by polaron-induced structural changes and charge-charge interactions, is the primary cause of instability.
- This study provides a mechanistic understanding of OMIEC material dynamics and instabilities during operation.
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