Mechanical Characterisation of Bond Formation during Overprinting of PEEK Laminates

The latest generation of high-temperature 3D printers enables the production of complex structural components from aerospace-grade thermoplastics such as PEEK (polyether ether ketone). However, adding long or continuous fibres is currently limited, and thermal stresses introduced during the process restrict the maximum part dimensions. Combining 3D-printed components with continuous fibre-reinforced components into one hybrid structure has the potential to overcome such limitations. This work aims to determine whether in situ bonding between PEEK laminates and PEEK 3D printing during overprinting is feasible and which process parameters are significantly responsible for the bonding quality. To this end, the bonding is analysed experimentally in two steps. Firstly, the influence of the process parameters on the thermal history and the strength of the bond is investigated. In the second step, a detailed investigation of the most critical parameters is carried out. The investigation showed the feasibility of overprinting with bonding strengths of up to 15 MPa. It was shown that the bonding strength depends primarily on the temperature in the interface. Additionally, the critical parameters to control the process were identified. The process influences that were displayed form the basis for future hybrid component and process designs.