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Higher-Order Topological Peierls Insulator in a Two-Dimensional Atom-Cavity System
Joana Fraxanet1, Alexandre Dauphin1, Maciej Lewenstein1,2
1ICFO-Institut de Ciències Fotòniques, The Barcelona Institute of Science and Technology, 08860 Castelldefels (Barcelona), Spain.
Ultracold bosonic atoms in an optical cavity exhibit a novel 2D Peierls transition, forming a plaquette order. This leads to a higher-order topological phase with unique corner states, achievable in quantum simulators.
Area of Science:
- Quantum Simulation
- Condensed Matter Physics
- Atomic Physics
Background:
- The Su-Schrieffer-Heeger (SSH) model describes 1D bond dimerization driven by electron-phonon interactions.
- Topological phases of matter exhibit unique properties protected by topology.
- Higher-order topological phases host protected states at boundaries of lower dimensionality.
Purpose of the Study:
- Investigate novel topological phases in ultracold atomic systems.
- Explore photon-mediated interactions for emergent phenomena.
- Generalize 1D topological models to 2D using bosonic atoms.
Main Methods:
- Utilizing a 2D system of ultracold bosonic atoms in an optical cavity.
- Inducing photon-mediated interactions to drive atomic correlations.
- Characterizing the topological phase using many-body invariants and entanglement analysis.
- Employing adiabatic protocols for experimental preparation.
Main Results:
- Observed a plaquette-ordered bond pattern in the atomic ground state, analogous to a 2D Peierls transition.
- Demonstrated the emergence of a nontrivial topological gap in 2D.
- Identified a higher-order topological phase hosting corner states.
- Confirmed the crucial role of bosonic statistics in forming the plaquette structure.
Conclusions:
- Atomic quantum simulators can realize novel strongly correlated topological phenomena.
- Photon-mediated interactions offer a pathway to engineer complex topological phases.
- The discovered higher-order topological Peierls insulator provides a new platform for studying topological matter.
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