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Related Experiment Video

Updated: Jul 4, 2025

A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires

A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires

Published on: January 21, 2016

Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion.

Jie Cao¹, Xusheng Liu^1,2, Jie Qiu¹

¹Frontier Institute of Chip and System, State Key Laboratory of Integrated Chips and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China.

Nature Communications

|February 6, 2024

Summary

This summary is machine-generated.

Researchers developed a new method to strengthen stretchable electronics using hydrophilic polyurethane and gold. This improves durability and enables high-fidelity signal acquisition for on-skin applications, even after extensive friction.

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Last Updated: Jul 4, 2025

A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires

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Published on: January 21, 2016

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

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Published on: March 13, 2017

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

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Published on: September 2, 2015

Area of Science:

Materials Science
Nanotechnology
Biomedical Engineering

Background:

Stretchable electronics require robust interfaces for reliable on-skin applications.
Chemically inert metals in current devices have weak adhesion to elastomers, limiting durability against friction.

Purpose of the Study:

To develop a strategy for enhancing interfacial binding strength in stretchable electronics.
To improve the friction tolerance and long-term stability of gold-based stretchable devices.

Main Methods:

Utilized an interfacial diffusion-induced cohesion strategy with hydrophilic polyurethane to wet gold (Au) grains.
Created a nanoscale rough configuration of polyurethane (RPU) to further enhance binding.
Tested electrical conductivity and signal acquisition after extensive friction and pressure.

Main Results:

Achieved high interfacial binding strength of 1017.6 N/m (Au-polyurethane) and 1243.4 N/m (Au-RPU).
Demonstrated excellent electrical conductivity retention after 10^22 friction cycles at 130 kPa.
Successfully recorded high-fidelity electrophysiological signals and constructed an anti-friction pressure sensor array.

Conclusions:

The interfacial diffusion-induced cohesion strategy significantly enhances the mechanical durability of stretchable electronics.
This approach offers a promising, chemical-free method for strengthening inert metal-based stretchable devices.
The developed technology is suitable for 3D integration and on-chip interconnection in advanced electronic systems.