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Utilization of Plasmonic and Photonic Crystal Nanostructures for Enhanced Micro- and Nanoparticle Manipulation

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Programming crack patterns with light in colloidal plasmonic films.

Fanny Thorimbert¹, Mateusz Odziomek², Denis Chateau³

¹Sorbonne Université, CNRS, UMR 7574, Chimie de la Matière Condensée de Paris, F-75005, Paris, France.

Nature Communications

|February 7, 2024

Summary

Scientists can now control crack patterns in materials using light. This method manipulates crack propagation in colloidal films, offering new possibilities for material durability and low-cost patterning.

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Area of Science:

Materials Science
Nanotechnology
Physics

Background:

Crack formation is a common, undesirable phenomenon across many scientific fields, often leading to material failure.
Controlling or programming crack paths presents a significant technological challenge with potential benefits for material durability and patterning.
Existing methods for crack control are limited, necessitating novel approaches.

Purpose of the Study:

To demonstrate a method for organizing, guiding, replicating, or arresting crack propagation in colloidal films.
To utilize remote light manipulation inspired by negative phototropism in plants.
To develop a programmable crack patterning technique.

Main Methods:

Employing plasmonic photothermal absorbers to generate "virtual" defects that guide crack deviation.
Engineering a dip-coating process for simultaneous material deposition and crack patterning.
Utilizing selective light irradiation for precise control over crack paths.

Main Results:

Successful organization and guidance of crack propagation in colloidal films via light manipulation.
Demonstration of crack replication and arrest through controlled light exposure.
Achieved simultaneous deposition and light-directed crack patterning.

Conclusions:

Remote light manipulation using plasmonic absorbers offers a novel way to control crack formation.
This technique enables programmable crack patterning in colloidal films with long-range order.
The approach holds promise for enhancing material durability and developing advanced patterning methods.