Effect of Surface Wettability on Nanoparticle Deposition during Pool Boiling on Laser-Textured Copper Surfaces

Area of Science:

• Heat Transfer
• Surface Science
• Nanotechnology

Background:

• Boiling heat transfer enhancement is crucial for thermal management.
• Nanofluid deployment in pool boiling faces challenges like nanoparticle deposition.
• Superhydrophobic surfaces offer potential for improved boiling performance.

Purpose of the Study:

• To investigate the pool boiling heat transfer of TiO2-water nanofluids on superhydrophobic surfaces.
• To assess nanoparticle deposition mitigation strategies.
• To evaluate the impact on heat transfer coefficient and critical heat flux.

Main Methods:

• Utilizing TiO2-water nanofluids at 0.001 wt.% and 0.1 wt.%.
• Employing superhydrophobic laser-textured copper surfaces.
• Conducting five consecutive boiling curve runs under saturated conditions.

Main Results:

• Nanofluids caused significant heat transfer deterioration on superhydrophilic surfaces due to nanoparticle deposition.
• Nanoparticle deposition was mitigated on superhydrophobic surfaces, but performance remained lower than with pure water.
• Critical heat flux (CHF) showed a slight enhancement (16-27%) with 0.1 wt.% nanofluids compared to pure water.

Conclusions:

• Superhydrophobic surfaces effectively mitigate nanoparticle deposition in pool boiling with TiO2-water nanofluids.
• While not improving the heat transfer coefficient, nanofluids can slightly enhance CHF on these surfaces.
• Further research is needed to optimize nanofluid composition and surface properties for enhanced boiling performance.