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Decomposition of the anisotropic strain in 3D-structure GaN layers using Raman spectroscopy
Kazuma Takeuchi1, Hiroyuki Ogura2, Noriyuki Hasuike3
1Corporate R&D Group, Keihanna Research Center, Kyocera Corporation, 3-5-3 Hikaridai, Seika-cho, Soraku-gun, Kyoto, Japan. kazuma.takeuchi.cy@kyocera.jp.
Researchers developed a Raman spectroscopy technique to measure axial strain in gallium nitride microdevices. This method accurately analyzes anisotropic strain, crucial for advancing semiconductor device performance and miniaturization.
Area of Science:
- Materials Science
- Solid State Physics
- Optoelectronics
Background:
- Strain engineering in gallium nitride (GaN) is vital for improving optoelectronic and electronic devices.
- Miniaturization of GaN devices necessitates precise understanding of strain states.
- Current methods lack axial resolution for strain evaluation in microscale devices.
Purpose of the Study:
- To establish an axially resolved strain measurement technique for c-plane gallium nitride.
- To investigate the link between anisotropic strain and Raman peak splitting.
- To enable accurate strain decomposition in microarea devices.
Main Methods:
- Utilized Raman spectroscopy with specific polarized configurations ([Formula: see text] and [Formula: see text]).
- Induced anisotropic strain in 3D c-plane GaN structures via epitaxial lateral overgrowth.
- Analyzed the split Raman peaks to deduce the axial strain components.
Main Results:
- Demonstrated a correlation between anisotropic strain in c-plane GaN and Raman peak splitting.
- Successfully developed a method for axially decomposing strain in GaN using Raman spectroscopy.
- The technique is feasible with conventional Raman spectrometers and applicable to other wurtzite crystals.
Conclusions:
- A novel Raman spectroscopy-based technique for axially resolving strain in microarea wurtzite materials, including GaN, has been established.
- This method provides a new perspective for understanding complex strain states.
- Accurate strain comprehension will accelerate R&D of III-V semiconductor devices.
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