Void-Engineered Metamaterial Delay Line with Built-In Impedance Matching for Ultrasonic Applications

Metamaterials exhibit unique ultrasonic properties that are not always achievable with traditional materials. However, the structures and geometries needed to achieve such properties are often complex and difficult to obtain using common fabrication techniques. In the present research work, we report a novel metamaterial acoustic delay line with built-in impedance matching that is fabricated using a common 3D printer. Delay lines are commonly used in ultrasonic inspection when signals need to be separated in time for improved sensitivity. However, if the impedance of the delay line is not perfectly matched with those of both the sensor and the target medium, a strong standing wave develops in the delay line, leading to a lower energy transmission. The presented metamaterial delay line was designed to match the acoustic impedance at both the sensor and target medium interfaces. This was achieved by introducing graded engineered voids with different densities at both ends of the delay line. The measured impedances of the designed metamaterial samples show a good match with the theoretical predictions. The experimental test results with concrete samples show that the acoustic energy transmission is increased by 120% and the standing wave in the delay line is reduced by over a factor of 2 compared to a commercial delay line.