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Temperature Hotspot Detection on Printed Circuit Boards (PCBs) Using Ultrasonic Guided Waves-A Machine Learning

Lawrence Yule1, Nicholas Harris1, Martyn Hill2

  • 1Smart Electronic Materials and Systems Research Group, School of Electronics and Computer Science, Faculty of Engineering and Physical Sciences, University of Southampton, Southampton SO17 1BJ, UK.

Sensors (Basel, Switzerland)
|February 24, 2024
PubMed
Summary
This summary is machine-generated.

This study uses ultrasonic guided waves and machine learning to detect temperature hotspots on printed circuit boards (PCBs) non-invasively. This method achieves high accuracy with minimal sensors, crucial for reliable electronics in aerospace and automotive applications.

Keywords:
COMSOLPWAScondition monitoringguided wavesprinted circuit boards

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Acoustics

Background:

  • Traditional temperature monitoring of printed circuit boards (PCBs) using numerous sensors can be intrusive and affect electronic component operation.
  • Developing non-invasive, high-resolution temperature monitoring is critical for advanced electronics, especially in aerospace and automotive sectors.

Purpose of the Study:

  • To investigate the use of ultrasonic guided waves with Piezoelectric Wafer Active Sensors (PWAS) for non-invasive PCB temperature hotspot detection.
  • To evaluate the effectiveness of machine learning algorithms in identifying hotspots using a minimal sensor configuration.

Main Methods:

  • Simulated wave propagation through a simplified PCB model using COMSOL multiphysics under varying temperature conditions.
  • Applied machine learning algorithms to analyze sensor data for hotspot identification at component locations.
  • Systematically varied the number and configuration of Piezoelectric Wafer Active Sensors (PWAS).

Main Results:

  • Achieved a high accuracy of 97.6% for hotspot detection using four PWAS.
  • Demonstrated a reduced accuracy of 88.1% with a single sensor in a pulse-echo configuration.
  • The methodology provides sufficient spatial resolution for effective hotspot identification.

Conclusions:

  • Ultrasonic guided waves offer a non-invasive and efficient solution for high-resolution PCB temperature monitoring.
  • This approach enhances condition-monitoring technologies essential for the reliability and safety of electronic systems in electrified industries.
  • The proposed method supports the advancement of electronics in demanding sectors like aerospace and automotive.