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Updated: Jul 3, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Parylene-bonded micro-fluidic channels for cryogenic experiments at superfluid He-4 temperatures
Š Midlik1, I Gablech2, M Goleňa1
1Faculty of Mathematics and Physics, Charles University, Prague, Czech Republic.
Abstract:
We present the manufacturing process of a (24.5 × 100) μm2-sized on-chip flow channel intended for flow experiments with normal and superfluid phases of 4He and showcase such a proof-of-concept experiment. This work proves the suitability of chip-to-chip bonding using a thin layer of Parylene-C for cryogenic temperatures as a simpler alternative to other techniques, such as anodic bonding. A monocrystalline silicon chip embeds the etched meander-shaped micro-fluidic channel and a deposited platinum heater and is bonded to a Pyrex glass top. We test the leak tightness of the proposed bonding method for superfluid 4He, reaching temperatures of ≈1.6 K and evaluate its possible effects on flow experiments. We demonstrate that powering an on-chip platinum heater affects the superfluid flow rate by local overheating of a section of the micro-fluidic channel.
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