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Updated: Jul 1, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
1Department of Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Avenue, Ann Arbor, MI, 48109, USA. ypwu@umich.edu.
Researchers developed a topological laser using InAs/InGaAs quantum dots on silicon. This Dirac-vortex microcavity laser demonstrates a wide spectral range and stability against size changes.
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