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NiTi-Cu Bimetallic Structure Fabrication through Wire Arc Additive Manufacturing.

Shalini Singh1, Elena Demidova2, Natalia Resnina2

  • 1Mechatronics and Instrumentation Laboratory, Discipline of Mechanical Engineering, Indian Institute of Technology Indore, Indore 453552, Madhya Pradesh, India.

Materials (Basel, Switzerland)
|March 13, 2024
PubMed
Summary
This summary is machine-generated.

This study optimized joining Nitinol (NiTi) shape memory alloys (SMAs) to Copper (Cu) using wire arc additive manufacturing (WAAM). Heat treatment at 500°C for 12 hours restored functional properties and enhanced mechanical strength for advanced applications.

Keywords:
shape memory alloysstructurewire arc additive manufacturing

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Area of Science:

  • Materials Science
  • Metallurgy
  • Additive Manufacturing

Background:

  • Shape Memory Alloys (SMAs), particularly Nitinol (NiTi), offer unique functional properties for advanced applications.
  • Integrating NiTi with other materials like Copper (Cu) presents challenges in maintaining alloy performance.
  • Novel joining techniques are crucial for overcoming integration barriers and unlocking material potential.

Purpose of the Study:

  • To investigate the integration of NiTi onto Cu using wire arc additive manufacturing (WAAM).
  • To analyze the interfacial characteristics and functional properties of the NiTi/Cu bimetallic junction.
  • To determine optimal heat treatment parameters for restoring and enhancing the NiTi/Cu joint performance.

Main Methods:

  • Wire Arc Additive Manufacturing (WAAM) for NiTi deposition on Cu.
  • Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), and Differential Scanning Calorimetry (DSC) for interface analysis.
  • Controlled heat treatment experiments to optimize martensitic transformation and mechanical properties.

Main Results:

  • A complex interfacial mixed zone was identified, containing various Ti(Ni,Cu)2, Cu, Ti2(Ni,Cu)3, and Ni-rich NiTi precipitates.
  • Initial DSC results showed challenges in demonstrating functional properties due to broad, low-intensity peaks.
  • Heat treatment at 500°C for 12 hours successfully restored distinct transformation peaks and improved NiTi layer distribution.
  • Optimized joints achieved micro-hardness of 485 HV and compressive strength up to 650 MPa.

Conclusions:

  • WAAM is a viable technique for creating NiTi/Cu bimetallic structures.
  • Post-deposition heat treatment is essential for restoring the functional properties of NiTi/Cu joints.
  • Optimized NiTi/Cu joints exhibit significant mechanical strength, enabling diverse electro-mechanical applications.