A Cu-Ag double-layer coating strategy for stable and reversible Zn metal anodes

Structuring a stable artificial coating to mitigate dendrite growth and side reactions is an effective strategy for protecting the Zn metal anode. Herein, a Cu-Ag double-layer metal coating is constructed on the Zn anode (Zn@Cu-Ag) by simple and in-situ displacement reactions. The Cu layer enhances the bond between the Ag layer and Zn substrate by acting as an intermediary, preventing the Ag coating from detachment. Concurrently, the Ag layer serves to improve the corrosion resistance of Cu metal. During plating, the initial Cu sheets and Ag particles on the surface of Zn@Cu-Ag electrode gradually transform into a flat and smooth layer, resulting in the formation of AgZn, AgZn₃, and (Ag, Cu)Zn₄ alloys. Alloys play a multifunctional role in inhibiting dendrite growth and side reactions due to decreased resistance, low nucleation barrier, enhanced zincophilicity, and strong corrosion resistance. Consequently, the Zn@Cu-Ag symmetric cell exhibits continuous stable performance for 3750 h at 1 mA cm^-2. Furthermore, the Zn@Cu-Ag||Zn₃V₃O₈ full cell achieves an initial capacity of 293.4 mAh g^-1 and realizes long cycling stability over 1200 cycles. This work provides new insight into the engineering of an efficient artificial interface for highly stable and reversible Zn metal anodes.