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Updated: Jun 29, 2025

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
Published on: January 17, 2017
Myeongho Park1,2, Bin Yoo1,2, Myeonghwan Hong1,2
1Department of Electronics Engineering, Myongji University, Yongin 17058, Republic of Korea.
Optimizing microchip assembly with fluidic self-assembly (FSA) technology requires careful spacing of binding sites. Increasing spacing beyond 140 μm significantly reduces incorrect microchip assemblies, improving process efficiency.
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