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Laser welding of fiber array units
Applied Optics
|April 3, 2024
Summary
Near-IR laser welding enables strong glass-to-glass bonds for fiber array unit (FAU) connectors. This innovative method eliminates costly V-groove plates, ensuring high fiber placement accuracy and long-term reliability with minimal epoxy use.
Area of Science:
- Photonics and Optical Engineering
- Materials Science and Engineering
- Manufacturing Technology
Background:
- Traditional fiber array unit (FAU) connector fabrication often relies on expensive V-groove plates for fiber alignment.
- Achieving robust glass-to-glass bonds and precise fiber placement is critical for high-performance optical interconnects.
- Minimizing epoxy usage and ensuring material compatibility are key challenges in miniaturized optical packaging.
Purpose of the Study:
- To develop an alternative fabrication method for fiber array unit (FAU) connectors using near-infrared (near-IR) laser welding.
- To demonstrate the feasibility of achieving strong glass-to-glass bonds without V-groove plates.
- To evaluate the impact of epoxy properties on the long-term reliability of the fabricated FAU connectors.
Main Methods:
- Fabrication of fiber array units (FAU) utilizing a near-IR laser welding process.
- Deposition of a thin metal film on planar glass substrates to enhance laser absorption for localized heating.
- Assembly using low coefficient of thermal expansion (CTE) epoxies for minimal structural support and environmental protection.
Main Results:
- Successful implementation of near-IR laser welding for precise fiber locking and strong glass-to-glass bonding.
- Elimination of the need for expensive V-groove plates, while maintaining high fiber placement accuracy.
- Minimized epoxy application, primarily for macro-component securing and environmental sealing, contributing to long-term reliability.
Conclusions:
- Near-IR laser welding offers a cost-effective and accurate method for fabricating fiber array units (FAU).
- The developed process ensures robust optical connections with enhanced long-term reliability due to optimized material selection and minimal epoxy use.
- This technique presents a viable alternative for high-precision optical packaging in demanding applications.

