Zinc hybrid sintering for printed transient sensors and wireless electronics

Transient electronics offer a promising solution for reducing electronic waste and for use in implantable bioelectronics, yet their fabrication remains challenging. We report on a scalable method that synergistically combines chemical and photonic mechanisms to sinter printed Zn microparticles. Following reduction of the oxide layer using an acidic solution, zinc particles are agglomerated into a continuous layer using a flash lamp annealing treatment. The resulting sintered Zn patterns exhibit electrical conductivity values as high as 5.62 × 10⁶ S m^-1. The electrical conductivity and durability of the printed zinc traces enable the fabrication of biodegradable sensors and LC circuits: temperature, strain, and chipless wireless force sensors, and radio-frequency inductive coils for remote powering. The process allows for reduced photonic energy to be delivered to the substrate and is compatible with temperature-sensitive polymeric and cellulosic substrates, enabling new avenues for the additive manufacturing of biodegradable electronics and transient implants.