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Liu Shi1,2,3,4, Cunfeng Wei1,2,3,4, Tong Jia1,2,3,4
1Beijing Engineering Research Center of Radiographic Techniques and Equipment, Institute of High Energy Physics, Chinese Academy of Sciences, Beijing, China.
This study introduces a novel segmentation model for printed circuit board (PCB) inspection using X-ray computed laminography (CL) imaging. The method effectively suppresses artifacts, enabling accurate extraction of PCB circuit layer information.
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