Effect of Grain Structure of Gold Plating Layer on Environmental Reliability of Sintered Ag-Au Joints

Gold-plated substrate is widely used in sintering with silver paste because of its high conductivity, stability, and corrosion resistance. However, due to massive interdiffusion between Ag and Au atoms, it is challenging for sintered Ag-Au joints to maintain high reliability. In order to study the effect of grain structure of gold plating layer on the environmental reliability of sintered Ag-Au joints, we prepared four substrates with different gold structures. In addition to the original gold structure (Au substrate), other gold structures were obtained by heat treatment at temperatures of 150 °C (Au-150 substrate), 250 °C (Au-250 substrate), and 350 °C (Au-350 substrate) for 1 h. Compared with the other three gold substrates, the sinter jointed on the Au-350 substrate obtained the highest shear strength. By analyzing the grain structure of the gold plating layer, it is found that the average grain size of the Au-350 substrate is the largest, and the proportion of low-angle grain boundaries is less. Few grain boundaries have a positive impact on inhibiting the excessive diffusion of Ag atoms and improving the bonding performance of the joint. Based on the above study, we further evaluated the environmental reliability of sintered joints. In 150 °C high-thermal storage, the interdiffusion of Ag and Au in the sintered joint on the Au-350 substrate was restricted, retaining stronger bonding until 200 h. In a hygrothermal environment of 85 °C/85% RH, the shear strength of the sintered Ag-Au joint with the Au-350 substrate maintained above 40.2 MPa during 100 h aging. The results indicated that the sintered Ag-Au joint on the Au-350 substrate with the largest grain size has superior high thermal reliability and hygrothermal reliability.