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Influence of Manufacturing Process on the Conductivity of Material Extrusion Components: A Comparison between
Maximilian Nowka1, Karl Hilbig1, Lukas Schulze1
1Institute for Engineering Design, Technische Universität Braunschweig, Hermann-Blenk-Str. 42, 38108 Brausnchweig, Germany.
Polymers
|April 27, 2024
Summary
Extrusion temperature significantly impacts the electrical resistivity of 3D-printed conductive PLA structures. Larger nozzle diameters also reduce resistivity variance, enabling cost-effective material extrusion (MEX) process selection.
Area of Science:
- Materials Science
- Additive Manufacturing
- Electrical Engineering
Background:
- Additive manufacturing (AM) allows integrating functional components, like conductive elements, into single parts.
- Material extrusion (MEX) is a versatile AM process for creating complex geometries with diverse materials.
Purpose of the Study:
- To investigate the influence of MEX process parameters on the electrical resistivity of conductive PLA specimens.
- To determine the significant factors affecting resistivity in additively manufactured conductive structures.
Main Methods:
- Specimens were fabricated using filaments and granules of carbon nanotube and carbon black-filled conductive PLA.
- A full-factorial design varied extrusion temperature, deposition speed, and production process.
- Electrical resistivity was measured using a four-wire method.
Main Results:
- Extrusion temperature was the only significant process variable influencing resistivity.
- A larger nozzle diameter significantly reduced resistivity variance by an order of magnitude.
- Resistivity was generally lower with larger nozzle diameters across most parameter sets.
Conclusions:
- Extrusion temperature is a critical parameter for controlling electrical resistivity in MEX conductive parts.
- Nozzle diameter plays a crucial role in reducing variability and achieving lower resistivity.
- The MEX manufacturing process itself does not significantly affect resistivity, allowing selection based on cost or other factors.
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