A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress
Shuai Zhou1,2, Kaixue Ma1, Yugong Wu1
1School of Microelectronics, Tianjin University, Tianjin 300072, China.
Micromachines
|April 27, 2024
Summary
3D packaging storage modules can fail due to thermal fatigue from rapid temperature changes. Cracks from plastic and creep strains, exacerbated by CTE differences, are key failure factors, confirmed by simulations within 10% accuracy.
Area of Science:
- Materials Science
- Mechanical Engineering
- Reliability Engineering
Background:
- Reliability enhancement testing technology is crucial for advanced electronic packaging.
- Understanding stress-strain properties of 3D packaging storage modules is vital for device longevity.
Purpose of the Study:
- To analyze the stress-strain properties of 3D packaging storage modules.
- To evaluate operating and destruction limits during temperature cycling tests.
- To identify weak points and failure mechanisms impacting reliability.
Main Methods:
- Utilized a variety of testing combinations and finite element simulations.
- Conducted temperature cycling tests ranging from -65 °C to +150 °C.
- Analyzed stress-strain behavior and failure modes.
Main Results:
- 3D packaging storage devices are susceptible to thermal fatigue failure under abrupt temperature changes.
- Accumulation of plastic and creep strains leads to crack formation, a primary failure mechanism.
- Coefficient of Thermal Expansion (CTE) differences between epoxy resin and solder joints accelerate crack formation.
Conclusions:
- Finite element simulations closely matched experimental testing results, with a deviation within 10%.
- Thermal fatigue is a significant failure mode for 3D packaging storage modules under cyclic temperature stress.
- Identifying and mitigating CTE mismatch effects is critical for enhancing the reliability of 3D packaging.
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