A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress

Shuai Zhou1,2, Kaixue Ma1, Yugong Wu1

  • 1School of Microelectronics, Tianjin University, Tianjin 300072, China.

Micromachines
|April 27, 2024
PubMed
Summary

3D packaging storage modules can fail due to thermal fatigue from rapid temperature changes. Cracks from plastic and creep strains, exacerbated by CTE differences, are key failure factors, confirmed by simulations within 10% accuracy.

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