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Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band.

Chaouki Hannachi¹, Matthieu Egels¹, Philippe Pannier¹

¹Institut Matériaux Microélectronique Nanosciences de Provence (IM2NP), CNRS, UMR 7334, Aix-Marseille Université, 13000 Marseille, France.

Sensors (Basel, Switzerland)

|April 27, 2024

Summary

Manufacturing variations in monolithic hybrid microwave integrated circuits (MHMIC) at 60 GHz were studied. The research quantifies acceptable dimensional variations for thin-film components and bonding ribbons to improve MHMIC fabrication accuracy.

Keywords:

MHMICs TRL accuracy analysis bonding calibration error manufacturing millimeter-wave radial stub resistors thin-layer tolerances transmission lines uncertainties

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Area of Science:

Electrical Engineering
Microwave Engineering
Materials Science

Background:

Monolithic Hybrid Microwave Integrated Circuits (MHMIC) are crucial for 60 GHz millimeter-wave applications.
Manufacturing process uncertainties can significantly impact MHMIC performance.
Understanding fabrication tolerances is key to achieving reliable circuit performance.

Purpose of the Study:

To investigate manufacturing uncertainties in MHMIC fabrication at 60 GHz.
To assess the impact of tolerances in thin-film components and bonding on circuit performance.
To establish relationships between manufacturing variations and circuit parameters for improved fabrication.

Main Methods:

Experimental quantification of manufacturing tolerances for key MHMIC components.
Analysis of implementation tolerances for gold microstrip transmission lines, titanium oxide resistors, radial stubs, and gold-bonding ribbons.
Prototyping and performance evaluation of MHMIC circuits to assess tolerance impacts.

Main Results:

Identified acceptable dimensional variations for critical MHMIC components to maintain reasonable performance.
Quantified the impact of manufacturing tolerances on MHMIC circuit parameters.
Demonstrated a correlation between fabrication variations and circuit performance metrics.

Conclusions:

Manufacturing tolerances for thin-film components and bonding significantly affect 60 GHz MHMIC performance.
Establishing relationships between tolerances and circuit parameters allows for enhanced accuracy and flexibility in MHMIC fabrication.
This study provides a framework for optimizing MHMIC manufacturing processes by managing dimensional variations.