An investigation of methods to enhance adhesion of conductive layer and dielectric substrate for additive manufacturing of electronics

Area of Science:

• Materials Science
• Surface Engineering
• Additive Manufacturing

Background:

• Printed electronics offer efficient fabrication on diverse substrates.
• Poor adhesion between conductive layers and dielectric substrates limits device durability.

Purpose of the Study:

• To enhance adhesion between nanoparticle silver ink and polyetheretherketone (PEEK) dielectric substrates.
• To investigate the effects of sulfuric acid and UV laser surface treatments on adhesion force.

Main Methods:

• PEEK substrate surface modification using varied sulfuric acid exposure times and UV laser scanning velocities.
• Characterization of surface properties including morphology, roughness, elemental composition, and water contact angle.
• Measurement of adhesion force using a pull-off adhesion tester after silver ink deposition.

Main Results:

• Adhesion force increased from 0.37 MPa (unmodified) to 1.99 MPa (sulfuric acid) and 2.21 MPa (UV laser).
• Sequential application of both treatments yielded the highest adhesion force of 2.77 MPa.
• Surface modification mechanisms influencing binding force were elucidated.

Conclusions:

• Sulfuric acid and UV laser treatments are effective for enhancing PEEK-silver ink adhesion in additive manufacturing.
• Surface modification strategies are crucial for improving the performance and reliability of printed electronics.