Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

Electrodeposition01:08

Electrodeposition

626
Electrodeposition is a technique used to separate an analyte from interferents by electrochemical processes. Here, the analyte is a metal ion that can be deposited on an electrode immersed in the sample solution. The electrochemical setup consists of an anode and a cathode. When an electric current is applied to the setup, oxidation occurs at the anode. At the cathode, which consists of a large metal surface, metal ions undergo reduction and deposit onto the surface.
Electrodeposition can...
626
Precipitation and Co-precipitation01:17

Precipitation and Co-precipitation

1.8K
Precipitation and coprecipitation methods can be used to separate a mixture of ions in a solution. In qualitative inorganic analysis, ions that form sparingly soluble precipitates with the same reagent are separated based on the differences in solubility products. For example, consider the separation of Cu(II) and Fe(II) ions by precipitation as insoluble sulfides. First, copper(II) sulfide is precipitated by the addition of acidic H2S, where the dissociation of H2S is suppressed. Adding H2S...
1.8K
Extraction: Advanced Methods00:56

Extraction: Advanced Methods

446
Metal ions can be separated from one another by complexation with organic ligands–the chelating agent– to form uncharged chelates. Here, the chelating agent must contain hydrophobic groups and behave as a weak acid, losing a proton to bind with the metal. Since most organic ligands used in this process are insoluble or undergo oxidation in the aqueous phase, the chelating agent is initially added to the organic phase and extracted into the aqueous phase. The metal-ligand complex is...
446
Preparation and Reactions of Thiols02:33

Preparation and Reactions of Thiols

6.2K
Thiols are prepared using the hydrosulfide anion as a nucleophile in a nucleophilic substitution reaction with alkyl halides. For instance, bromobutane reacts with sodium hydrosulfide to give butanethiol.
6.2K
EDTA: Auxiliary Complexing Reagents01:26

EDTA: Auxiliary Complexing Reagents

580
EDTA titrations are usually carried out in highly basic conditions, where the fully deprotonated form of EDTA, Y4−, actively complexes with the free metal ions in the solution. Several metal ions precipitate as hydrous oxide (hydroxides, oxides, or oxyhydroxides) under these conditions, lowering the concentration of free metal ions in the solution. For this reason, auxiliary complexing agents or ligands such as ammonia, tartrate, citrate, or triethanolamine are used in EDTA titrations to...
580
Precipitation Titration: Endpoint Detection Methods01:19

Precipitation Titration: Endpoint Detection Methods

1.7K
In argentometric precipitation titrations, endpoints can be detected visually by the Mohr, Volhard, and Fajans methods. In the Mohr method, adding a soluble chromate indicator gives an initial yellow color to the analyte solution. As the titrant is added, the first excess of silver ions forms a red silver chromate precipitate, marking the endpoint. The solution pH should be maintained at about 8 by adding solid CaCO3.
In the Volhard method, a standard excess of AgNO3 is first added to the...
1.7K

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Refining the interpretation of JAK2-CHIP-associated Parkinsonism: Phenotypic overlap, causal inference, and conceptual framework.

Journal of the Formosan Medical Association = Taiwan yi zhi·2026
Same author

Iron-Doped CoNi-MOF-Derived Carbon Coated CoNi Alloy Nanoparticles as Bifunctional Oxygen Electrocatalysts for Rechargeable Zinc-Air Batteries.

Small (Weinheim an der Bergstrasse, Germany)·2025
Same author

Prevalence and clinical impact of JAK2-CHIP: Association with Parkinsonism and hematologic changes in a population cohort.

Journal of the Formosan Medical Association = Taiwan yi zhi·2025
Same author

Aerosol-assisted synthesis of hybrid/composite porous nanostructures for CO<sub>2</sub> utilization.

Chemical communications (Cambridge, England)·2025
Same author

CO<sub>2</sub> Capture-Mineralization for Calcium-Looping Integrated with Methane Dry Reforming.

Langmuir : the ACS journal of surfaces and colloids·2025
Same author

Rapid detection of impurity particles in etching solutions using electrospray-differential mobility analysis.

Talanta·2025

Related Experiment Video

Updated: Jun 26, 2025

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
07:00

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Published on: March 20, 2019

15.1K

Quantifying thiolated chemical additives for copper electroplating process.

Ying-Hsuan Wang1, Duraisamy Senthil Raja1, De-Hao Tsai1

  • 1Department of Chemical Engineering, National Tsing Hua University, No. 101, Sec. 2, Kuang-Fu Rd., 300044, Hsinchu City, Taiwan.

Analytica Chimica Acta
|May 8, 2024
PubMed
Summary
This summary is machine-generated.

This study presents a new method using gold nanoparticles to accurately measure thiolated additives in copper electroplating solutions, crucial for optimizing copper foil manufacturing. The technique enables precise control over the production of high-quality copper foil.

Keywords:
AdsorptionCu electroplatingElectrosprayGold nanoparticlesInfrared spectroscopy

More Related Videos

Preparation of Expanded Chitin Foams and their Use in the Removal of Aqueous Copper
06:36

Preparation of Expanded Chitin Foams and their Use in the Removal of Aqueous Copper

Published on: February 27, 2021

3.6K
Quantifying the Binding Interactions Between CuII and Peptide Residues in the Presence and Absence of Chromophores
11:38

Quantifying the Binding Interactions Between CuII and Peptide Residues in the Presence and Absence of Chromophores

Published on: April 5, 2022

2.4K

Related Experiment Videos

Last Updated: Jun 26, 2025

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
07:00

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Published on: March 20, 2019

15.1K
Preparation of Expanded Chitin Foams and their Use in the Removal of Aqueous Copper
06:36

Preparation of Expanded Chitin Foams and their Use in the Removal of Aqueous Copper

Published on: February 27, 2021

3.6K
Quantifying the Binding Interactions Between CuII and Peptide Residues in the Presence and Absence of Chromophores
11:38

Quantifying the Binding Interactions Between CuII and Peptide Residues in the Presence and Absence of Chromophores

Published on: April 5, 2022

2.4K

Area of Science:

  • Materials Science
  • Analytical Chemistry

Background:

  • Copper foil is vital for electronics due to its conductivity and ductility.
  • Thiolated additives (accelerators, inhibitors) are critical in copper electroplating but difficult to characterize.
  • High ionic strength and acidity of plating baths complicate additive analysis.

Purpose of the Study:

  • To develop a facile and accurate method for quantifying thiolated additives in copper electroplating solutions.
  • To enable precise control over copper foil manufacturing processes.

Main Methods:

  • Utilized gold nanoparticles (AuNPs) as adsorbents to isolate thiolated additives (PEG-SH, MPA) from interfering substances.
  • Employed attenuated total reflection-Fourier transform infrared spectroscopy (ATR-FTIR) for quantitative analysis of AuNPs.
  • Used electrospray-differential mobility analyzer (EDMA) for orthogonal quantitative analysis of adsorbed thiolated additives.

Main Results:

  • Successfully separated and quantified poly(ethylene glycol) methyl ether thiol (PEG-SH) and 3-mercaptopropionic acid (MPA).
  • Established detection concentration ranges: 5–100 μM for PEG-SH and 10–200 μM for MPA.
  • Demonstrated the effectiveness of AuNPs and ATR-FTIR/EDMA for additive analysis.

Conclusions:

  • A robust separation and analysis methodology for thiolated additives in copper electroplating solutions was successfully developed.
  • This method facilitates precise control over the copper foil manufacturing process.
  • The findings contribute to improved quality and consistency in electronic applications utilizing copper foil.