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One Stone Two Birds: Anomalously Enhancing the Cross-Plane and In-Plane Heat Transfer in 2D/3D Heterostructures by

Quanjie Wang1, Yucheng Xiong2, Cheng Shao3

  • 1Institute of Micro/Nano Electromechanical System and Integrated Circuit, College of Mechanical Engineering, State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Donghua University, Shanghai, 201620, China.

Small Methods
|May 9, 2024
PubMed
Summary

Introducing defects to the substrate surface significantly boosts heat dissipation in 2D/3D electronic devices. This novel approach enhances interfacial thermal conductance (ITC) and 2D material thermal conductivity (κ) for better device performance.

Keywords:
heterostructureinterfacial thermal conductancephonon transferthermal conductivitythermal management

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