circCDK13-loaded small extracellular vesicles accelerate healing in preclinical diabetic wound models

Qilin Huang1,2, Ziqiang Chu2,3, Zihao Wang2,3,4

  • 1Tianjin Medical University, No. 22, Qixiangtai Road, Heping District, Tianjin, 300070, China.

PubMed

Insights

This study identifies circCDK13 as a therapeutic molecule for diabetic wound healing. Loading circCDK13 into small extracellular vesicles (sEVs) accelerated healing and skin regeneration in preclinical diabetic wound models.

Area of Science:

  • Biomedical Engineering
  • Molecular Biology
  • Regenerative Medicine

Background:

  • Chronic wounds, particularly in diabetic patients, represent a significant clinical challenge.
  • Current treatments for diabetic wounds have limitations in efficacy and healing speed.

Purpose of the Study:

  • To identify and characterize a novel therapeutic circular RNA (circRNA) for diabetic wound treatment.
  • To engineer small extracellular vesicles (sEVs) for targeted delivery of the therapeutic circRNA.
  • To evaluate the efficacy of circRNA-loaded sEVs in preclinical models of diabetic wound healing.

Main Methods:

  • Identification of circCDK13 and its mechanism of action involving IGF2BP3 and N6-Methyladenosine (m6A) modification.
  • Engineering of sEVs to overexpress circCDK13.
  • Preclinical testing in db/db diabetic mice and streptozotocin-induced diabetic rats.

Main Results:

  • CircCDK13 promotes fibroblast and keratinocyte proliferation and migration by enhancing CD44 and c-MYC expression.
  • Engineered sEVs loaded with circCDK13 accelerated wound healing and skin appendage regeneration in diabetic mouse and rat models.
  • Local subcutaneous injection of circCDK13-loaded sEVs demonstrated therapeutic potential.

Conclusions:

  • CircCDK13 is a promising therapeutic agent for promoting diabetic wound healing.
  • sEVs serve as an effective delivery vehicle for circCDK13, enhancing its therapeutic efficacy.
  • This approach offers a potential new strategy for treating chronic diabetic wounds.