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Nanoscale Three-Dimensional Imaging of Integrated Circuits Using a Scanning Electron Microscope and Transition-Edge
Nathan Nakamura1,2, Paul Szypryt1,2, Amber L Dagel3
1National Institute of Standards and Technology, Boulder, CO 80305, USA.
Sensors (Basel, Switzerland)
|May 11, 2024
Summary
A new laboratory-scale X-ray nanotomography instrument uses a scanning electron microscope and a superconducting detector to achieve nanoscale imaging. This compact system overcomes limitations of large synchrotron facilities for materials characterization.
Area of Science:
- Materials Science
- Nanotechnology
- X-ray Physics
Background:
- X-ray nanotomography is crucial for nanoscale material characterization.
- Current methods are limited by X-ray flux and spot size, requiring large synchrotron facilities.
- A need exists for compact, high-resolution laboratory-scale nanotomography.
Purpose of the Study:
- To present a novel laboratory-scale X-ray nanotomography instrument.
- To achieve nanoscale spatial resolution outside of synchrotron facilities.
- To overcome limitations of conventional X-ray tomography.
Main Methods:
- Combined a scanning electron microscope (SEM) electron beam with a superconducting transition-edge sensor (TES) microcalorimeter.
- Generated a focused X-ray spot on a metal target near the sample.
- Utilized energy-resolved X-ray detection for high signal-to-noise ratio.
Main Results:
- Demonstrated nanoscale, element-specific X-ray imaging in a compact footprint.
- Successfully imaged 160 nm features in a 3D Cu-SiO2 integrated circuit.
- Achieved nanoscale spatial resolution with a laboratory-based system.
Conclusions:
- The developed instrument offers a viable alternative to synchrotron-based nanotomography.
- The combination of SEM and TES enables high-resolution, element-specific imaging.
- Future work can enhance resolution and imaging capabilities for advanced materials analysis.
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