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Tailoring amorphous boron nitride for high-performance two-dimensional electronics
Cindy Y Chen1, Zheng Sun2, Riccardo Torsi1
1Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA, 16802, USA.
Nature Communications
|May 13, 2024
Summary
We developed a low-temperature atomic layer deposition process to create uniform amorphous boron nitride (aBN) dielectric films on 2D materials. This scalable method enhances the performance of 2D electronic devices.
Area of Science:
- Materials Science
- Nanotechnology
- Solid State Physics
Background:
- Two-dimensional (2D) materials possess unique electronic and optoelectronic properties crucial for next-generation devices.
- Achieving high performance in 2D material devices is hindered by challenges in forming uniform dielectric layers and preventing interfacial defects.
- Precise control over the dielectric environment is essential for unlocking the full potential of 2D materials.
Purpose of the Study:
- To demonstrate a scalable, low-temperature atomic layer deposition (ALD) process for synthesizing uniform amorphous boron nitride (aBN) thin films on 2D materials.
- To evaluate the impact of aBN dielectric layers on the electronic and optoelectronic properties of molybdenum disulfide (MoS2) based devices.
- To overcome the limitations of current dielectric integration methods for 2D materials.
Main Methods:
- Utilized atomic layer deposition (ALD) at low temperatures (<250°C) to synthesize amorphous boron nitride (aBN) thin films.
- Employed a seed-free ALD approach to achieve uniform and conformal aBN dielectric layers on 2D material surfaces.
- Fabricated multiple quantum well structures and double-gated monolayer MoS2 field-effect transistors with aBN dielectrics.
Main Results:
- Achieved wafer-scale synthesis of uniform, conformal aBN thin films with high oxidative stability.
- Demonstrated excellent dielectric strength of 8.2 MV/cm for the synthesized aBN films.
- Showcased the successful integration of aBN dielectrics in MoS2-based devices, enabling evaluation of their optoelectronic and electronic properties.
Conclusions:
- The developed low-temperature, seed-free ALD process enables scalable integration of high-quality aBN dielectrics for 2D materials.
- This advancement addresses critical challenges in dielectric integration, paving the way for improved 2D material device performance.
- The findings facilitate the realization of theoretical performance limits in next-generation 2D electronics and photonics.
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