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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
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Recent advances in multifunctional electromagnetic interference shielding materials.

Quy-Dat Nguyen1,2, Choon-Gi Choi1,2

  • 1Graphene Research Team, Materials and Components Research Division, Superintelligence Creative Research Laboratory, Electronics and Telecommunication Research Institute (ETRI), Daejeon, 34129, Republic of Korea.

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|May 21, 2024
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Summary
This summary is machine-generated.

Multifunctional electromagnetic interference (EMI) shielding materials integrate advanced functions beyond shielding. This review explores recent progress, challenges, and future directions in developing these crucial materials for modern electronics.

Keywords:
Electromagnetic interference shieldingHeatingMXeneMultifunctionSensingThermal management

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrical Engineering

Background:

  • Electromagnetic interference (EMI) shielding is critical for protecting electronics and health from electromagnetic radiation.
  • The fourth industrial revolution drives demand for compact, multi-functional electronic devices.
  • Existing EMI shielding materials (metals, carbon, MXenes) often lack integrated functionalities.

Purpose of the Study:

  • To review recent advancements in multifunctional EMI shielding materials.
  • To discuss the integration of additional functions (sensing, thermal management) into EMI shielding materials.
  • To identify challenges and propose future research directions in this field.

Main Methods:

  • Comprehensive literature review of cutting-edge multifunctional EMI shielding materials.
  • Analysis of material properties enabling combined EMI shielding and other functions.
  • Discussion of strategies for engineering multifunctionality and balancing performance.

Main Results:

  • Emerging multifunctional EMI shielding materials offer combined properties like strain, humidity, and temperature sensing.
  • Integration of functions like thermal management alongside EMI shielding is feasible.
  • Balancing EMI shielding efficiency with additional functionalities presents significant challenges.

Conclusions:

  • Multifunctional EMI shielding materials are essential for next-generation compact and integrated electronic systems.
  • Further research is needed to overcome performance trade-offs and develop novel materials.
  • Future directions include exploring new material combinations and advanced engineering techniques.