Patterned Micro Flexible Supercapacitors based on the Rapid Transfer-Printing Method

Developing a simple and rapidly preparative method for patterned flexible supercapacitors is essential and indispensable for the swift advancement of portable devices integrated with micro devices. In this study, we employed a cost-effective and rapid fabrication method based on transfer-printing technology to produce patterned micro flexible supercapacitors with various substrates. The resulting flexible micro supercapacitors not only allow for customized patterns with strong flexibility and resistance to bending, while maintaining a certain level of performance, but also facilitate the creation of diverse circuits to tailor voltage and current to specific requirements. Patterned micro flexible supercapacitors with a thickness of 0.02 mm, based on accordion-like Ti₃C₂T MXene materials coated on a substrate, demonstrate a specific capacitance of 142.7 mF cm^-2 at 0.5 mA cm^-2. The devices exhibit satisfactory capacitance retention (91% after 5000 cycles) and superb mechanical flexibility (71% capacitance retention at 180° bending after 2000 cycles). At a power density of 2.9 mW cm^-2, the energy density of the sandwich structure device reaches 126.8 μWh cm^-2. This study is expected to contribute new ideas for the design and preparation of patterned flexible supercapacitors.