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Updated: Jun 25, 2025

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Published on: January 26, 2016
Evaluating Free Thermal Expansion and Glass Transition of Ultrathin Polymer Films on Heated Liquid
Tae-Ik Lee1, Ji Hun Kim2, Dong Jun Kim2
1Advanced Packaging and Integration Center, Joining R&D Group, KITECH, 156 Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Republic of Korea.
Abstract:
Thermomechanical properties of ultrathin films are crucial for fabrication and use of reliable thin electronic devices. Due to the lack of precise measurement techniques, the thermal deformation behavior of ultrathin films has not yet been clarified. Here, we propose a film on heated liquid (FOHL) method to simultaneously measure the coefficient of thermal expansion (CTE) and glass transition temperature (Tg) of multiple ultrathin polymer films. Free thermal expansion of thin films without substrate interaction can be guaranteed when the thin films are afloat on a liquid surface. To investigate the thermal behavior in a wide temperature range, glycerol is adopted as a thermally stable heating platform owing to its high boiling point of 290 °C. The thin films are transferred onto the glycerol surface from the water surface using the hygroscopic properties of glycerol. Highly accurate and high-throughput thermal strain measurement is achieved using three-dimensional digital image correlation (3D-DIC). The thermomechanical properties of ultrathin polystyrene thin films of various thicknesses (25-400 nm) are precisely characterized utilizing the FOHL and 3D-DIC method.
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