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Updated: Jun 25, 2025

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
Published on: August 28, 2018
CMOS Scaling for the 5 nm Node and Beyond: Device, Process and Technology.
Henry H Radamson1, Yuanhao Miao1, Ziwei Zhou1
1Research and Development Center of Optoelectronic Hybrid IC, Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou 510535, China.
Moore's Law is ending, driving innovation in 3D transistors like gate-all-around (GAA) and fully depleted silicon-on-insulator (FDSOI) designs. These advanced transistor architectures aim to overcome scaling limits and enable future low-power electronics.
Area of Science:
- Semiconductor Device Physics
- Materials Science
- Electrical Engineering
Background:
- Moore's Law and the International Technology Roadmap for Semiconductors (ITRS) are nearing their limits for traditional complementary metal oxide semiconductor (CMOS) architectures.
- Scaling challenges, particularly short channel effects (SCEs), hinder further miniaturization of transistors.
- The need for advanced transistor designs is critical for continued progress in electronics.
Purpose of the Study:
- To review emerging transistor designs beyond current CMOS technology.
- To explore solutions for scaling down to and beyond the 5 nm technology node.
- To discuss the integration of electronics and photonics, simulation methods, and processing challenges.
Main Methods:
- Review of current literature on advanced transistor architectures.
- Analysis of gate-all-around (GAA) transistors for overcoming SCEs.
- Discussion of fully depleted silicon-on-insulator (FDSOI) and tunneling field-effect transistors (TFETs) for low-power applications.
- Exploration of simulation techniques and metrology for device characterization.
Main Results:
- Gate-all-around (GAA) transistors show promise for scaling beyond 5 nm by mitigating short channel effects.
- Fully depleted SOI (FDSOI) and tunneling field-effect transistors (TFETs) offer potential for low-power electronics.
- Innovative processing and metrology techniques are essential for fabricating and characterizing next-generation devices.
- Integration of electronics and photonics is a key area for future development.
Conclusions:
- The end of Moore's Law necessitates the exploration of novel transistor designs like GAA, FDSOI, and TFETs.
- Advanced device architectures are crucial for overcoming scaling limitations and enabling future electronic systems.
- Successful implementation requires addressing significant challenges in device processing, design, and characterization using advanced metrology.
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