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Updated: Jun 25, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Effects of Curing Defects in Adhesive Layers on Carbon Fiber-Quartz Fiber Bonded Joint Performance
Xiaobo Yang1, Miaomiao Zhang1, Lihua Zhan2
1College of Mechanical and Electrical Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China.
Curing defects in adhesively bonded carbon fiber-quartz fiber composites significantly impact performance in stealth aviation. Optimizing curing temperature and pressure is crucial for joint strength, while defect types like voids and edge flaws are most detrimental.
Area of Science:
- Materials Science
- Aerospace Engineering
- Composite Materials
Background:
- Adhesively bonded joints of carbon fiber-quartz fiber composites are critical for stealth aviation.
- Curing defects in these joints negatively affect service performance.
- Understanding thermophysical parameter evolution and defect impact is essential.
Purpose of the Study:
- Analyze thermophysical parameter evolution of adhesive films during curing.
- Simulate and assess the impact of void defects on tensile properties.
- Clarify the effects of curing process parameters on bonding performance.
Main Methods:
- Dynamic and isothermal differential scanning calorimetry (DSC).
- Thermal gravimetric analysis (TGA).
- Orthogonal tests simulating prefabricating defects and varying curing parameters.
Main Results:
- J-116 B adhesive film cures starting at 160 °C, forming a 3D mesh structure.
- Thermal degradation occurs above 200 °C, weakening the adhesive.
- Adhesive strength is sensitive to defect types (triangle, edge, penetration) and void ratios.
- Curing temperature significantly impacts bonding; curing pressure affects void morphology and distribution.
Conclusions:
- Curing temperature and pressure are key parameters for optimizing adhesive joint performance in composites.
- Defect type and ratio are critical factors influencing bond strength.
- Heating rate and heat preservation time have minor effects on bonding performance.
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