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Enhancing the Delamination Efficiency of Polyimide-Copper Bilayers with UV/Heat-Activated Foamable Adhesive: Insights

Wichean Khawdas1, Yuko Sawada1, Ken Miyata2

  • 1Research Center for GREEN Materials and Advanced Processing, Yamagata University, Yonezawa, Yamagata 992-8510, Japan.

ACS Applied Materials & Interfaces
|June 8, 2024
PubMed

Keywords:
E-waste recyclingUV-induced polymerdelaminationepoxy-silane copolymerfoaming adhesiveplastic metallization

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