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Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and

Julian Vogelwaid1,2, Martin Bayer1, Michael Walz1

  • 1Mobility Electronics, Engineering Technology Polymer & Packaging, Robert Bosch GmbH, 72770 Reutlingen, Germany.

Polymers
|June 19, 2024
PubMed
Summary
This summary is machine-generated.

In-line control of molding processes using thermo-analytical methods improves packaging quality. Higher injection speeds create polymer networks with lower glass transition temperatures and increased storage modulus, impacting material properties.

Keywords:
dielectric analysis (DEA)dynamic mechanical analysis (DMA)epoxy molding compound (EMC)glass transition temperature (Tg)heterogeneitymonitoringresponse surface

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Area of Science:

  • Materials Science
  • Polymer Engineering
  • Process Control

Background:

  • In-line control of molding processes is crucial for product quality and reliability of packaging materials.
  • Accurate determination of material properties through thermo-analytical methods aids in predicting packaging performance.
  • Highly filled molding resins present challenges in property analysis and process control.

Purpose of the Study:

  • To verify the quality of predictive models for molding processes using highly filled resins.
  • To validate these models by analyzing the impact of varying silica particle content.
  • To establish a comprehensive approach for monitoring material property evolution during molding and post-mold curing.

Main Methods:

  • Dielectric analysis (DEA), differential scanning calorimetry (DSC), warpage analysis, and dynamic mechanical analysis (DMA) were employed.
  • Design of Experiments (DoE) and response surface plots were used to analyze the effects of temperature and injection speed.
  • Monitoring of ionic viscosity (IV), residual enthalpy (dHrest), glass transition temperature (Tg), and storage modulus (E) was established.

Main Results:

  • The study analyzed the effects of temperature and injection speed on morphological properties.
  • Reliability of glass transition temperature (Tg) estimation was tested using warpage analysis and DMA.
  • High cure rates in highly filled materials led to signal quality deterioration.
  • Increased injection speed resulted in a polymer network with lower Tg and higher storage modulus, indicating heterogeneity.

Conclusions:

  • In-line monitoring and thermo-analytical methods are vital for controlling molding processes and ensuring packaging material quality.
  • Process parameter variations, such as injection speed, significantly influence the final polymer network structure and properties.
  • Understanding these relationships allows for optimized material design and process control for enhanced packaging performance.