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Published on: January 23, 2013
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Molding Process Retaining Gold Nanoparticle Assembly Structures during Transfer to a Polycarbonate Surface.
Philipp Zimmermann1, Daniel Schletz2, Marisa Hoffmann2
1Institut für Polymerwerkstoffe, Leibniz-Institut für Polymerforschung Dresden e.V., Hohe Straße 6, D-01069 Dresden, Germany.
Polymers
|June 19, 2024
Summary
Gold nanoparticle (AuNP) assemblies maintain their ordered structure when molded onto polycarbonate surfaces. This process enables the creation of functional plasmonic devices and nanowires.
Area of Science:
- Materials Science
- Nanotechnology
- Polymer Science
Background:
- Immobilizing ordered gold nanoparticle (AuNP) assemblies on polymer surfaces is crucial for developing advanced optical devices.
- Preserving the precise arrangement of nanoparticles during processing is a significant challenge.
Purpose of the Study:
- To investigate the immobilization of AuNP linear surface assemblies on polycarbonate (PC) melt surfaces using molding.
- To assess the structural fidelity and preservation of plasmonic properties during the injection molding process.
Main Methods:
- Utilizing molding techniques to transfer AuNP assemblies onto PC melt surfaces.
- Employing Scanning Electron Microscopy (SEM) and image analysis to quantify structural order using an orientational order parameter.
- Characterizing optical properties via ultraviolet-visible-near-infrared (UV-Vis-NIR) spectroscopy to determine dichroic ratios.
Main Results:
- The order of AuNP assemblies was preserved during the molding process, with an order parameter of approximately 0.98.
- The assemblies exhibited strong plasmonic coupling and dichroic properties, quantified by dichroic ratios of 0.28 and 0.52.
- The immobilized AuNP assemblies demonstrated robustness, withstanding harsh processing conditions and chemical treatments.
Conclusions:
- Injection molding is an effective method for embedding AuNP assemblies onto polymer surfaces while maintaining structural integrity and optical properties.
- This technique bridges self-assembly methods with polymer processing, paving the way for scalable fabrication of plasmonic devices.
- The resulting AuNP line assemblies on PC serve as a foundation for applications such as surface-enhanced Raman scattering (SERS) sensors and nanowire precursors.

