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SPI-Modified h-BN Nanosheets-Based Thermal Interface Materials for Thermal Management Applications
Vanmathi Ravichandran1, Akshatha Chandrashekar2, T Niranjana Prabhu2
1Sustainable Nanomaterials and Technologies Lab, Department of Physics and Nanotechnology, SRM Institute of Science and Technology, Kattankulathur, Chengalpattu, Tamil Nadu 603203, India.
ACS Applied Materials & Interfaces
|June 19, 2024
Summary
This study developed eco-friendly thermal interface materials (TIMs) using soy protein isolate-functionalized boron nitride nanosheets in silicone oil. The new TIMs significantly enhance heat dissipation for electronics and LEDs.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- Electronic devices generate significant heat, necessitating efficient thermal interface materials (TIMs) for heat dissipation.
- Traditional silicone oil-based TIMs face limitations due to aging, toxic chemicals, and filler inefficiency.
- There is a need for advanced, eco-friendly TIMs with improved thermal conductivity and reliability.
Purpose of the Study:
- To develop novel, environmentally friendly TIMs using functionalized hexagonal boron nitride nanosheets (h-BNNS) and soy protein isolate (SPI) in a silicone oil (SO) matrix.
- To investigate the thermal properties and heat management capabilities of the developed composite TIMs.
- To evaluate the performance enhancement compared to conventional SO-based TIMs.
Main Methods:
- Exfoliation of h-BNNS and functionalization with SPI.
- Preparation of h-BNNS/SPI/SO composite TIMs via solution mixing.
- Characterization of material bonding using FTIR and thermal conductivity measurement using the modified transient plane source (MTPS) method.
- Evaluation of thermal resistance using the Foygel nonlinear model.
- Demonstration of heat management on a 10 W LED bulb.
Main Results:
- The functionalized h-BNNS/SPI fillers showed good compatibility with the SO matrix, evidenced by FTIR.
- The composite TIM achieved a maximum thermal conductivity of 1.162 Wm⁻¹K⁻¹ (833% enhancement) at 50 wt% filler (3:1 h-BNNS:SPI ratio).
- The developed TIM reduced the LED surface temperature by ~6 °C during heating and ~8 °C during cooling compared to pure SO.
Conclusions:
- Eco-friendly natural polymers like SPI can effectively stabilize and link layered materials (h-BNNS) for enhanced TIM performance.
- The developed h-BNNS/SPI/SO composite TIMs offer superior heat dissipation capabilities for electronic cooling applications.
- This approach presents a promising pathway for creating sustainable and high-performance thermal management solutions.
