Updated: Jun 23, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Kaelyn Leake1, Tristan Eberbach1, Alexander Stensland1
1Department of Physics, The Citadel - The Military College of South Carolina, Charleston, South Carolina 29409, USA.
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An automated system for laser-modified layer-by-layer assembly was developed. This robotic system fabricates patterned thin films, demonstrating its capability with electrochromic devices.
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